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   Tungsten Copper       Composite(WCu)

    Molybdenum Copper
      (Mo-Cu)

    Cu/Mo/Cu(CMC)

    Cu/MoCu/Cu(CPC)

    Glid Copper

    Oxygen-free Copper(OFC)

    Low CTE Alloys
Current Position: Home >> Products >> Heat Sinks >> Cu/MoCu/Cu (CPC)   (Click on the small picture to enlarge)
Product Brief Introduction:
Cu/Mo70Cu/Cu(CPC) is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu: Mo-Cu: Cu is 1:4:1. It has different CTE in X and direction, with higher thermal conductivity than that of W (Mo)-Cu & Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components,.

Features of Cu/Mo70Cu/Cu
Large sized sheets available (length up to XXmm, width up to XXmm)
More easily to be stamped into components than CMC
Very strong interface bonding which can repeatedly resist 850 heat shock
Higher thermal conductivity and lower cost
Product Properties:
Materials Density at 20 Coefficient of thermal expansion at 20 Thermal conductivity at 25
In - plane thru - thickness In - plane thru - thickness
1:4:1 9.4 7.2 9.0 340 300
Applications:
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages,GaAs device mount.
 


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