Tungsten Products

  Molybdenum Products

  Tungsten Electrodes

  Heat Sinks of Electronic     Packaging

    Tungsten(W)

    Molybdenum(Mo)

   Tungsten Copper       Composite(WCu)

    Molybdenum Copper
      (Mo-Cu)

    Cu/Mo/Cu(CMC)

    Cu/MoCu/Cu(CPC)

    Glid Copper

    Oxygen-free Copper(OFC)

    Low CTE Alloys
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Product Brief Introduction:
Mo-Cu composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.

Product Properties:
Physical Properties of Major Products

Material Wt%
Molybdenum Content
Wt%
Copper Content
g/cm3
Density at 20
Thermal conductivity at 25 Coefficient of thermal
expansion at 20
Mo85Cu15 85 1 Balance 10 160 - 180 6.8
Mo80Cu20 80 1 Balance 9.9 170 - 190 7.7
Mo70Cu30 70 1 Balance 9.8 180 - 200 9.1
Mo60Cu40 60 1 Balance 9.66 210 - 250 10.3
Mo50Cu50 50 0.2 Balance 9.54 230 - 270 11.5
Applications:
These composite are widely used in applications, such as, optoelectronics packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.
 


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