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Applications:
  • For producing electric light source parts, components of electric vacuum and electric power semiconductor
  • For producing Mo-boats, heat shield and heat bodies in high temperature furnace
  • Used to produce Sputtering Targets
Size:
0.05~50.0mm(Thickness) × 50~600mm(Width) × 100~3000mm
Chemical Composition:
Mo Content Total Content of Other Elements Each Element Content
≥99.95% ≤0.05% ≤0.01%


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